Semiconductor/DISPLAY chambers and internal structures made by Al and Ni, because it’s Good electrical conductivity and excellent corrosion resistance High quality characteristics according to device shrinkage Corrosion-resistant, plasma-resistant, chemical-resistant as required consequently Applied external coating such as anodizing, Y2O3, ALD with excellent properties.However, in processes above 200℃, problems such as cracks and arcing occur due

Along with factory automation, there is an increasing need for sensor technology that can diagnose processes. Existing optical sensor technology is suitable for dry etching equipment such as dry etcher, However CVD When applied to thin film deposition equipment, its use is limited due to issues such as decreased reliability due to the accumulation of

Customer Needs Cost Reduction Plasma Particle reduction Uniformity Improving Low price Simple design 200mm/300mm PE-CVD, Furnace New process response 80℃ ~ 550℃ process High performance Oxide, Nitride, ARC Customized "PE-CVD 구성 예" Chamber 상부 RPG module RF matcher RF

RF Cable Ass’y FOR LF RG213 Cable Ass’y Universally used Relatively light Vulnerable to heat deflection temperature 50℃ FOR HF RG393 Cable Ass’y The strongest thermal durability characteristics Power loss rate is low For High power Cable Ass’y FOR Above 10kW high power Mainly used for

Needs. Non-destructive test When B/M disassemble, assemble Indirectly Quality inspection Difficulty in analyzing the cause when a failure such as leak or short When B/M Cross section destructive test Indirectly Quality inspection Difficulty in analyzing the cause when a failure such as leak or short When B/M Cross section destructive test Indirectly